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Asian Journal of Applied Sciences
  Year: 2012 | Volume: 5 | Issue: 5 | Page No.: 299-306
DOI: 10.3923/ajaps.2012.299.306
 
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Effect of Post Heat Treatment on Dimensional Stability of UF Bonded Particleboard

P.S. H`ng, S.H. Lee and W.C. Lum

Abstract:
The objective of this present study was to propose a post heat treatment as a method to improve particleboard dimensional stability by decreasing wood hygroscopicity and releasing hotpressing stress. Rubberwood panels from rubberwood were treated in a laboratory press at three different temperatures (100, 150 and 180°C) for about 90, 180 and 270 sec. The wood-water relation variables, Thickness Swelling (TS) and Water Absorption (WA) were determined and compared with untreated panels. The results showed that the proposed thermal treatment was effective to reduce TS but didn’t affect WA. WA and density were not directly influenced by the treatment but it had been reduced with the increase of the duration of the treatment. Some of the panels were found meet the Japanese Industrial Standard which determines maximum values of 12%.
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How to cite this article:

P.S. H`ng, S.H. Lee and W.C. Lum, 2012. Effect of Post Heat Treatment on Dimensional Stability of UF Bonded Particleboard. Asian Journal of Applied Sciences, 5: 299-306.

DOI: 10.3923/ajaps.2012.299.306

URL: https://scialert.net/abstract/?doi=ajaps.2012.299.306

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