Subscribe Now Subscribe Today
Science Alert
 
Blue
   
Curve Top
Asian Journal of Applied Sciences
  Year: 2012 | Volume: 5 | Issue: 5 | Page No.: 299-306
DOI: 10.3923/ajaps.2012.299.306
 
Facebook Twitter Digg Reddit Linkedin StumbleUpon E-mail

Effect of Post Heat Treatment on Dimensional Stability of UF Bonded Particleboard
P.S. H`ng, S.H. Lee and W.C. Lum

Abstract: The objective of this present study was to propose a post heat treatment as a method to improve particleboard dimensional stability by decreasing wood hygroscopicity and releasing hotpressing stress. Rubberwood panels from rubberwood were treated in a laboratory press at three different temperatures (100, 150 and 180°C) for about 90, 180 and 270 sec. The wood-water relation variables, Thickness Swelling (TS) and Water Absorption (WA) were determined and compared with untreated panels. The results showed that the proposed thermal treatment was effective to reduce TS but didn’t affect WA. WA and density were not directly influenced by the treatment but it had been reduced with the increase of the duration of the treatment. Some of the panels were found meet the Japanese Industrial Standard which determines maximum values of 12%.
PDF Fulltext XML References Citation Report Citation
 RELATED ARTICLES:
  •    Termite Digestomes as a Potential Source of Symbiotic Microbiota for Lignocelluloses Degradation: A Review
  •    Effects of Formaldehyde Catcher on Some Properties of Particleboard with Different Ratio of Surface to Core Layer
  •    Response of Coptotermes curvignathus (Isoptera: Rhinotermitidae) to Formaldehyde Catcher-treated Particleboard
  •    Pepper Stalks (Capsicum annuum) as Raw Material for Particleboard Manufacturing
  •    Production of Low Formaldehyde Emission Particleboard by Using New Formulated Formaldehyde Based Resin
  •    Manufacture and Properties of Particleboard from Dhaincha (Sesbania aculeata)
  •    Fire Propagation and Strength Performance of Fire Retardant-Treated Hibiscus cannabinus Particleboard
How to cite this article:

P.S. H`ng, S.H. Lee and W.C. Lum, 2012. Effect of Post Heat Treatment on Dimensional Stability of UF Bonded Particleboard. Asian Journal of Applied Sciences, 5: 299-306.

DOI: 10.3923/ajaps.2012.299.306

URL: https://scialert.net/abstract/?doi=ajaps.2012.299.306
COMMENT ON THIS PAPER
 
 
 

 
  Bullet Navigation
 
  Page Icon Online First
  Page Icon Current Issue
  Page Icon Previous Issues
  Page Icon Editorial Board
  Page Icon Submit a Manuscript
  Page Icon Guide to Authors
  Page Icon Subscribe to E-alerts

  Bullet Indexed In
 
  Page Icon ASCI-Database
  Page Icon Asian Digital Library
  Page Icon Cambridge Scientific Abstract
  Page Icon Chemical Abstract Services
  Page Icon Google Scholar

Science Alert
Curve Bottom