Chien-Wen Chung
Department of Electronic Engineering, Far East College, 49 Chung-Hua Road, Hsin-Shih Town, Tainan 74404, Taiwan
June- Yule Lee
Department of Electronic Engineering, Far East College, 49 Chung-Hua Road, Hsin-Shih Town, Tainan 74404, Taiwan
Yi-Shing Huang
Department of Electronic Engineering, Far East College, 49 Chung-Hua Road, Hsin-Shih Town, Tainan 74404, Taiwan
Chia-Li Lin
Lexus Enterprise Co., Ltd. No. 26, Lane l, Chung-Cheng Road, Yung-Kang City,
Tainan 710, Taiwan
ABSTRACT
A system level thermal management of heat-sink module for power LED is considered in this study. The thermal interface material with aluminum and graphite plate are fabricated and integrated in power LED. The cooling performance of the designed heat-sink modules are demonstrated by measured the light output and the temperature on cathode side of LED. The proposed heat-sink modules demonstrate that a proper thermal management can maintain stable light output and extend system life. Results from experiments also show a large variation in junction temperature and light output among the different heat-sink modules.
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How to cite this article
Chien-Wen Chung, June- Yule Lee, Yi-Shing Huang and Chia-Li Lin, 2006. Enhancement of Heat Dissipation for High Brightness Light Emitting Diodes. Journal of Applied Sciences, 6: 2514-2516.
DOI: 10.3923/jas.2006.2514.2516
URL: https://scialert.net/abstract/?doi=jas.2006.2514.2516
DOI: 10.3923/jas.2006.2514.2516
URL: https://scialert.net/abstract/?doi=jas.2006.2514.2516
REFERENCES
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