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Asian Journal of Scientific Research

Year: 2013 | Volume: 6 | Issue: 2 | Page No.: 381-387
DOI: 10.3923/ajsr.2013.381.387

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Research Article

Thermal Model for Harvesting Waste Heat From Microprocessor using Shunt Configuration

Tai Zhi Ling
Asia R and D Software and Firmware Development, Western Digital Malaysia, Jalan SS 8/6, Sungai Way, 47300, Petaling Jaya, Selangor, Malaysia

Ong Hang See
Department of Electronics and Communication Engineering, Universiti Tenaga Nasional, km 7, Jalan Kajang Puchong, Kajang, Selangor, Malaysia

Microprocessor energy consumption has been growing especially in datacenter environment. However, there is a lack of investigation on using the thermal heat generated by the microprocessor as an alternative energy source. This study focused on the thermal profiling of the microprocessor integrated with an Microelectromechanical Systems (MEMS) Thermoelectric Generator (TEG) using shunt configuration. A 2D thermal model is developed to estimate the heat transfer of a complex geometry system. MATLAB simulation based on the thermal model is presented with two types of heat spreader material, copper and pyrolytic graphite. The advantages and their shortfalls with respect to the microprocessor heat dissipation and the effectiveness to generate a temperature gradient at the MEMS TEG are discussed.
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How to cite this article

Tai Zhi Ling and Ong Hang See, 2013. Thermal Model for Harvesting Waste Heat From Microprocessor using Shunt Configuration. Asian Journal of Scientific Research, 6: 381-387.

DOI: 10.3923/ajsr.2013.381.387

URL: https://scialert.net/abstract/?doi=ajsr.2013.381.387

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References


  1. Anonymous, 2006. Fiscal 2005 annual energy report (outline). Agency for Natural Resources and Energy, Ministry of Economy, Trade and Industry, June 2006.

  2. The Institute of Energy Economics Japan, 2011. APEC energy statistics 2009. Energy Working Group (EWG), Pages: 71.

  3. Bhuyan, M.S., M. Othman, S.H. Md Ali, B.Y. Majlis and M.S. Islam, 2013. Investigation on MEMS-based piezoelectric energy harvester design with aspect of autonomous automobile sensors. Asian J. Sci. Res., 6: 1-15.
    CrossRef

  4. An, Y.D. and B.S.M. Singh, 2011. Sustainable solar-wind hybrid power plant for implementation in Malaysia. J. Applied Sci., 11: 1121-1128.
    CrossRefDirect Link

  5. ISSCC, 2011. International Solid State Circuit Conference 2011 trends report. http://isscc.org/doc/2011/2011_Trends.pdf.

  6. Brill, K.G., 2007. The invisible crisis in the data center: The economic meltdown of moore's law. Uptime Institute.

  7. Bill, W., E. Bakker, P. Hamid, P. Hamid and F. Nogal et al., 2011. IBM zEnterprise 196 technical guide. pp: 354-355. http://www.redbooks.ibm.com/redpieces/pdfs/sg247833.pdf.

  8. Suski, E.D., 1995. Method and apparatus for recovering power from semiconductor using thermoelectric devices. US Patent, 5: 419-780.

  9. Solbrekken, G.L., K. Yazawa and A. Bar-Cohen, 2004. Thermal management of portable electronic equipment using thermoelectric energy conversion. Proceedings of The 9th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, June 1-4, 2004, USA., pp: 276-283.
    CrossRef

  10. Incropera, F.P., P.D. David, T.L. Bergman and S.L. Adrienne, 2010. Fundamentals of Heat and Mass Transfer. 6th Edn., John Wiley and Sons, New York, ISBN-10: 0471457280, pp: 928-957.

  11. Bottner, H., J. Nurnus, A. Gavrikov, G. Kuhner and M. Jagle et al., 2004. New thermoelectric components using microsystem technologies. J. Microelectromech. Syst., 13: 414-420.
    CrossRef

  12. Panasonic Industrial Co., 2011. PGS graphite sheets type: EYG. http://www.panasonic.com/industrial/electronic-components/parametric-search.aspx?src=/www-ctlg/ctlg/qAYA0000_AM.html.

Keywords


  • Microprocessor
  • MEMS thermoelectric
  • thermal modeling

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