Comparison of oxidation resistance of copper treated by beam-line ion implantation and plasma immersion ion implantation

Quanzhang An, Liuhe Li, Tao Hu, Yunchang Xin, Ricky K.Y. Fu, D.T.K. Kwok, Xun Cai and Paul K. Chu

Materials Chemistry and Physics 116 ( 2-3 ): 519 - 522 , 2009