Journal of Applied Sciences1812-56541812-5662Asian Network for Scientific Information10.3923/jas.2012.1939.1945ChauDinh Van1220121218Nanoclay-epoxy composites have been applied widely since they
have excellent properties which resulted from the incorporation of the nanoclay
material in epoxy matrix. However, the improved properties can degrade by presence
of water in the epoxy matrix, leading to limitation of service life of the material.
Diffusion of water having 40 and 60°C in the nanoclay-epoxy composites made
by direct mixing process was investigated through immersion test. The strength
of the materials was also measured by using the three point bending test. The
results showed that the two-stage diffusion process occurred when the composites
immersed in water at 60°C whereas the Fickian diffusion mode was observed
in case of water at 40°C. The saturation and the diffusion rate are influenced
by organoclay loading and by temperature. Increase of clay loading resulted
in an increase of the water saturation and reduction of diffusion rate of water.
The results also showed the significant influence of temperature on water absorption
of the composites. Water saturation, increased about 20% and water diffusion
rate was 5 time-higher when temperature of water shifted from 40 to 60°C.
Investigation of flexural strength was carried out by use of the three point
bending test. The results showed decrease of flexural strength with an increase
of clay loading for the composites. However, there was no significant change
of flexural strength during the immersion. Results for the neat resin showed
to the contrary.]]>Abacha, N., M. Kubouchi and T. Sakai,2009Adamson, M.J.,1980ASTM,2005Astaluta, G. and G.C. Sarti,1978Becker, O., Y.B. Cheng, R.J. Varley and G.P. Simon,2003Bharadwaj, R.K.,2001Crank, J.,1975Diamant, Y., G. Marom and L.J. Broutman,1981Fredrickson, G.H. and J. Bicerano,1999Frisch, H.L.,1980Gain, O., E. Espuche, E. Pollet, M. Alexandre and P. Dubois,2005Giannelis, E.P., 1996Gusev, A.A. and H.R. Lusti,2001Hansen, C.M.,1980Haque, E. and C.D. Armeniades,1986Jiankun, L., K. Yucai, Q. Zongneng and Y. Xiao-Su,2001Ke, Z. and B. Yongping,2005Kelly, P., A. Akelah, S. Qutubuddin and A. Moet,1994Kim, J.K., C. Hu, R.S.C. Woo and M.L. Sham,2005Kojima, Y., A. Usuki, M. Kawasumi, A. Okada, Y. Fukushima, T. Kurauchi and O. Kamigaito, 1993Kojima, Y., K. Fukumori, A. Usuki, A. Okada and T. Kurauchi,1993Komarneni, S.,1992Kornmann, X., H. Lindberg and L.A. Berglund,2001Kshirsagar, S., R.A. Lopez-Anido and R.K. Gupta,2000Lan, T. and T.J. Pinnavaia,1994LeBaron, P., Z. Wang and T. Pinnavaia, 1999Lee, H. and K. Neville,1957Lee, J.D. T. Takekoshi and E.P. Giannelis,1997Lu, M.G., M.J. Shim and S.W. Kim,2001Messersmith, P.B. and E.P. Giannelis, 1995Moy, P. and F.E. Karasz,1980Nguyen, T. and F.W. Martin,1996Nielsen, L.E.,1967Nunez, L., M. Villanueva, F. Fraga and M.R. Nunez,1999Okada, A., M. Kawasumi, A. Usuki, Y. Kojimi, T. Karauchi and O. Kamigato,1990Peterlin, A.,1980Picard, E., A. Vermogen, J.F. Grard and E. Espuche,2007Popineau, S., C. Rondeau-Mouro, C. Sulpice-Gaillet and M.E.R. Shanahan,2005Shen, C.H. and G.S. Springer,1976Thomas, N.L. and A.H. Windle,1980Vergnaud, J.M.,1991Wong, T.C. and L.J. Broutman,1985Yano, K., A. Usuki, A. Okada, T. Kurauchi and O. Kamigaito,1993Zerda, A.S. and A.J. Lesser,2001