Precision Study for Surface Tension Driven Self-assembly of Hingeless Structures
Abstract:
Surface tension driven self-assembly has been demonstrated
to be a promising method for mass production of highly 3-D MEMS structures.
However, factors and their mechanisms affecting the self-assembly precision
of the hingeless structures are still barely understood. This study addresses
and analyzes some of the factors, including the inherent instability of the
hingeless structures, scale effect and the deformations of the limiter structure
which limits the self-assembly precision of hingeless structures. An energy
based model, verified by the experimental results, was introduced to evaluate
the adverse effect of each factor on the precision. This precision study can
serve as an optimum guideline for the designs of self-assembly MEMS microstructures
and allow the creation of high precise MEMS applications.
How to cite this article
Lei Yang, Chunqing Wang and Wei Liu, 2013. Precision Study for Surface Tension Driven Self-assembly of Hingeless Structures. Journal of Applied Sciences, 13: 2807-2812.
REFERENCES
Brakke, K.A., 1996. The surface evolver and the stability of liquid surfaces. Philosoph. Trans. Royal Soc., 354: 2143-2157.
CrossRef
Brussel, H.V., J. Peirs, D. Reynaerts, A. Delchambre and G. Reinhart et al., 2000. Assembly of microsystems. Ann. CIRP, 49: 451-472.
CrossRef
Harsh, K.F., V.M. Bright and Y.C. Lee, 1999. Solder self-assembly for three-dimensional microelectromechanical systems. Sens. Actuators A., 77: 237-244.
CrossRef
Harsh, K.F., P.E. Kladitis, Y.H. Zhang, M.L. Dunn, V.M. Bright and Y.C. Lee, 2000. Tolerance and precision study for solder self-assembled MEMS. Proc. SPIE, 4075: 173-184.
CrossRef
Jack, W.J., 2001. Microelectromechanical systems (MEMS): Fabrication, design and applications. Smart Mat. Struc., 10: 1115-1134.
CrossRef
Syms, R.R.A., E.M. Yeatman, V.M. Bright and G.M. Whitesides, 2003. Surface tension-powered self-assembly of microstructures - the state-of-the-art. J. Microelectromech. Syst., 12: 387-417.
CrossRef
Wu, M.C., L.Y. Lin, S.S. Lee and K.S.J. Pister, 1995. Micromachined free-space integrated micro-optics. Sens. Actuators A., 50: 127-134.
CrossRef
Yang, L., W. Liu, C.Q. Wang and Y.H. Tian, 2011. Self-assembly of three-dimensional microstructures in MEMS via fluxless laser reflow soldering. Proceedings of the 12th International Conference on Electronic Packaging Technology and High Density Packaging, August 8-11 2011, Shanghai, China, pp: 649-652.
Yang, L., W. Liu, C.Q. Wang and Y.H. Tian, 2013. Surface-tension-driven self-assembly of 3-D microcomponents by using laser reflow soldering and wire limiting mechanisms. Trans. Comp. Pack. Manuf. Tech., 3: 168-176.
CrossRef
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