Subscribe Now Subscribe Today
Research Article

Precision Study for Surface Tension Driven Self-assembly of Hingeless Structures

Lei Yang, Chunqing Wang and Wei Liu
Facebook Twitter Digg Reddit Linkedin StumbleUpon E-mail

Surface tension driven self-assembly has been demonstrated to be a promising method for mass production of highly 3-D MEMS structures. However, factors and their mechanisms affecting the self-assembly precision of the hingeless structures are still barely understood. This study addresses and analyzes some of the factors, including the inherent instability of the hingeless structures, scale effect and the deformations of the limiter structure which limits the self-assembly precision of hingeless structures. An energy based model, verified by the experimental results, was introduced to evaluate the adverse effect of each factor on the precision. This precision study can serve as an optimum guideline for the designs of self-assembly MEMS microstructures and allow the creation of high precise MEMS applications.

Related Articles in ASCI
Search in Google Scholar
View Citation
Report Citation

  How to cite this article:

Lei Yang, Chunqing Wang and Wei Liu, 2013. Precision Study for Surface Tension Driven Self-assembly of Hingeless Structures. Journal of Applied Sciences, 13: 2807-2812.

DOI: 10.3923/jas.2013.2807.2812



1:  Brakke, K.A., 1996. The surface evolver and the stability of liquid surfaces. Philosoph. Trans. Royal Soc., 354: 2143-2157.
CrossRef  |  

2:  Brussel, H.V., J. Peirs, D. Reynaerts, A. Delchambre and G. Reinhart et al., 2000. Assembly of microsystems. Ann. CIRP, 49: 451-472.
CrossRef  |  

3:  Harsh, K.F., V.M. Bright and Y.C. Lee, 1999. Solder self-assembly for three-dimensional microelectromechanical systems. Sens. Actuators A., 77: 237-244.
CrossRef  |  

4:  Harsh, K.F., P.E. Kladitis, Y.H. Zhang, M.L. Dunn, V.M. Bright and Y.C. Lee, 2000. Tolerance and precision study for solder self-assembled MEMS. Proc. SPIE, 4075: 173-184.
CrossRef  |  

5:  Jack, W.J., 2001. Microelectromechanical systems (MEMS): Fabrication, design and applications. Smart Mat. Struc., 10: 1115-1134.
CrossRef  |  

6:  Syms, R.R.A., E.M. Yeatman, V.M. Bright and G.M. Whitesides, 2003. Surface tension-powered self-assembly of microstructures - the state-of-the-art. J. Microelectromech. Syst., 12: 387-417.
CrossRef  |  

7:  Wu, M.C., L.Y. Lin, S.S. Lee and K.S.J. Pister, 1995. Micromachined free-space integrated micro-optics. Sens. Actuators A., 50: 127-134.
CrossRef  |  

8:  Yang, L., W. Liu, C.Q. Wang and Y.H. Tian, 2011. Self-assembly of three-dimensional microstructures in MEMS via fluxless laser reflow soldering. Proceedings of the 12th International Conference on Electronic Packaging Technology and High Density Packaging, August 8-11 2011, Shanghai, China, pp: 649-652

9:  Yang, L., W. Liu, C.Q. Wang and Y.H. Tian, 2013. Surface-tension-driven self-assembly of 3-D microcomponents by using laser reflow soldering and wire limiting mechanisms. Trans. Comp. Pack. Manuf. Tech., 3: 168-176.
CrossRef  |  

©  2022 Science Alert. All Rights Reserved