Consolidation of WC-Ni/W-Ni Double-Layer Composite by Infiltration of Cu-Sn-Ni-Mn as Binder in SILP Process*

Miroud, D.; Tata, M.; Lebaili, S.

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Consolidation of WC-Ni/W-Ni Double-Layer Composite by Infiltration of Cu-Sn-Ni-Mn as Binder in SILP Process*

D. Miroud, M. Tata and S. Lebaili

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How to cite this article:

D. Miroud, M. Tata and S. Lebaili, 2010. Consolidation of WC-Ni/W-Ni Double-Layer Composite by Infiltration of Cu-Sn-Ni-Mn as Binder in SILP Process*. Asian Journal of Scientific Research, 3: 288-297.

DOI: 10.3923/ajsr.2010.288.297

URL: https://scialert.net/abstract/?doi=ajsr.2010.288.297