Articles by C. S. Foong (1)

Comparative Study of Different Underfill Material on Flip Chip Ceramic Ball Grid Array Based on Accelerated Thermal Cycling

Z. Kornain, A. Jalar, N. Amin, R. Rasid and C. S. Foong

American Journal of Engineering and Applied Sciences 3 ( 1 ): 83 - 89 , 2010

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