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Information Technology Journal

Year: 2014  |  Volume: 13  |  Issue: 4  |  Page No.: 795 - 800

Research of Network Properties and Power Consumption on THIN

Baojun Qiao, Shengbin Liang and Wei Wei

Abstract

A new chip design paradigm called Network-on-Chip (NoC) offers a promising architectural choice for future System-on-Chip (SoC). Communication latency and power efficiency are the most important concerns in NoC architecture design. Triple-based Hierarchical Interconnection Network (THIN) was proposed that aims to decrease the node degree, reduce the links and shorten the diameter. In this study, the zero-load latency and energy consumption are thoroughly studied and compared with 2-D mesh. The compare results show that THIN is a better candidate for constructing the NoC than 2-D mesh, when there are not too many nodes.

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