Abstract: A system level thermal management of heat-sink module for power LED is considered in this study. The thermal interface material with aluminum and graphite plate are fabricated and integrated in power LED. The cooling performance of the designed heat-sink modules are demonstrated by measured the light output and the temperature on cathode side of LED. The proposed heat-sink modules demonstrate that a proper thermal management can maintain stable light output and extend system life. Results from experiments also show a large variation in junction temperature and light output among the different heat-sink modules.