N. Amin
Department of Electrical, Electronic and System Engineering, National University of Malaysia, Bangi, 43600 Selangor, Malaysia
A.Y. Cheah
Department of Electrical, Electronic and System Engineering, National University of Malaysia, Bangi, 43600 Selangor, Malaysia
I. Ahmad
Department of Electronics and Communication, College of Engineering, Universiti Tenaga Nasional, Kajang 43009, Selangor, Malaysia
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How to cite this article
N. Amin, A.Y. Cheah and I. Ahmad, 2010. Effect of Plasma Cleaning Process in the Wettability of Flip Chip PBGA Substrate of Integrated Circuit Packages. Journal of Applied Sciences, 10: 772-776.
DOI: 10.3923/jas.2010.772.776
URL: https://scialert.net/abstract/?doi=jas.2010.772.776
DOI: 10.3923/jas.2010.772.776
URL: https://scialert.net/abstract/?doi=jas.2010.772.776