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Information Technology Journal
  Year: 2014 | Volume: 13 | Issue: 4 | Page No.: 795-800
DOI: 10.3923/itj.2014.795.800
 
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Research of Network Properties and Power Consumption on THIN

Baojun Qiao, Shengbin Liang and Wei Wei

Abstract:
A new chip design paradigm called Network-on-Chip (NoC) offers a promising architectural choice for future System-on-Chip (SoC). Communication latency and power efficiency are the most important concerns in NoC architecture design. Triple-based Hierarchical Interconnection Network (THIN) was proposed that aims to decrease the node degree, reduce the links and shorten the diameter. In this study, the zero-load latency and energy consumption are thoroughly studied and compared with 2-D mesh. The compare results show that THIN is a better candidate for constructing the NoC than 2-D mesh, when there are not too many nodes.
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How to cite this article:

Baojun Qiao, Shengbin Liang and Wei Wei, 2014. Research of Network Properties and Power Consumption on THIN. Information Technology Journal, 13: 795-800.

DOI: 10.3923/itj.2014.795.800

URL: https://scialert.net/abstract/?doi=itj.2014.795.800

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